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Description
Datasheet Dec 1, 2012 Thermal Resistance, Junction to Case. 3.5. 2. Device Marking. Device. Package. Reel Size. Tape Width. Quantity. 22CA. N9CC. FDMS3606S . Aug 9, 2014 Manufacturing Site. Weight*. UOM. Unit Type. FDMS3606S . FDMS3606S . Power- 56 8L 5x6 w S&G clip. Dual Die. INTERNAL CEBU. 0.121565. Aug 8, 2014 Material Declaration. Site Owner. Assembly. Location. Package. Weight(g). MSL. Rating. FDMS3606S . Power-56 8L 5x6 w S&G clip Dual Die.
| Part Number | FDMS3606S |
| Main Category | Discrete Semiconductor Products |
| Sub Category | Transistors - FETs, MOSFETs - Arrays |
| Brand | Microchip |
| Description | MOSFET 2N-CH 30V 13A/27A PWR56 |
| Series | PowerTrench |
| Packaging | Cut Tape (CT) |
| FET Type | 2 N-Channel (Dual) Asymmetrical |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | 30V |
| Current - Continuous Drain (Id) @ 25°C | 13A, 27A |
| Rds On (Max) @ Id, Vgs | 8 mOhm @ 13A, 10V |
| Vgs(th) (Max) @ Id | 2.7V @ 250µA |
| Gate Charge (Qg) (Max) @ Vgs | 29nC @ 10V |
| Input Capacitance (Ciss) (Max) @ Vds | 1785pF @ 15V |
| Power - Max | 1W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 8-PowerTDFN |
| Supplier Device Package | 8-PQFN (5x6), Power56 |
| Image |  |
FDMS3606S
MICROCIHIP
3286
1.07
HK HEQING ELECTRONICS LIMITED
FDMS3606S
MICROCH
35800
1.565
WEISOK ELECTRONICS (HK) TECHNOLOGY LIMITED
FDMS3606S
MICRCHIP
3000
2.06
Shenzhen Qiangneng Electronics Co., Ltd.
FDMS3606S
MICORCHIP
9000
2.555
SUMMER TECH(HK) LIMITED
FDMS3606S
MICRONCHIP
3000
3.05
HONG KONG HORNG SHING LIMITED
