Description
MIXED SIGNAL MOBILE EMBEDDED CON Series: - Applications: I/O Controller Core Processor: ARC-625D Program Memory Type: FLASH (192 kB) Controller Series: - RAM Size: 16KB Interface: ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC Number of I/O: 115 Voltage - Supply: 3.3V Operating Temperature: -40~C ~ 85~C Mounting Type: Surface Mount Package / Case: 144-LFBGA Supplier Device Package: 144-LFBGA (10x10)
Part Number | MEC1609I-PZP |
Main Category | Integrated Circuits (ICs) |
Sub Category | Embedded - Microcontrollers - Application Specific |
Brand | Microchip |
Description | MIXED SIGNAL MOBILE EMBEDDED CON |
Series | - |
Packaging | Tube |
Applications | I/O Controller |
Core Processor | ARC-625D |
Program Memory Type | FLASH (192 kB) |
Controller Series | - |
RAM Size | 16KB |
Interface | ACPI, BC-Link, I²ÂC/SMBus, LPC, PECI, PS/2, SPI, VLPC |
Number of I/O | 115 |
Voltage - Supply | 3.3V |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 144-LFBGA |
Supplier Device Package | 144-LFBGA (10x10) |
Image |
MEC1609I-PZP
MICROCIHIP
5000
1.03
HK HEQING ELECTRONICS LIMITED
MEC1609I-PZP
MICROCH
5000
1.6075
HONG KONG BOCETON ELECTRONIC TECHNOLOGY CO., LIMITED
MEC1609I-PZP
MICRCHIP
3361
2.185
ROSSONIX CO.,LTD
MEC1609I-PZP
MICORCHIP
12000
2.7625
YO CHIP(HONG KONG)TRADING CO LIMITED
MEC1609I-PZP
MICRONCHIP
3000
3.34
HONG KONG YUE JIN PENG ELECTRONICS CO.